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• Características principales:
  • Simple tool-free installation
  • Springs maintain constant and uniform pressure to ensure reliable thermal contact
  • Mechanical attachment provides secure mounting where vibration is a concern
  • Fits industry Standard Hole patterns
  • Accommodates up to 4mm stack height (typical 1.5mm PCB and 2.5 mm BGA package)

• Especificaciones:
  Hole Drawing:

  
  Width: 28.50

  Length: 28.50

  Height: 10.00

  Base Thickness: 1.75
  Fin Thickness: Length 2.10, Width 1.50
  # of Fins: Length 9, Width 10
  Fin Tip to Tip: 0.00

  Finish: Black Anodize

  Thermal Performance

  Natural Convection:

  30.60
  Forced convection:

  9.26
  Thermal Curve:

  

Official Site